Housing of an LED display device and method for manufacturing the same
US10112327B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 20, 2015 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Sep 11, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3475
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a housing of an LED display device includes the steps of: (a) filling a first material into a first mold assembly at a first place to form a cover with a plurality of first display holes, followed by moving the cover to a second place, filling a second material into a second mold assembly and the cover to seal one of the plurality of the first display holes via a plurality of first transparent members; and (b) disposing an ink layer on a display side of the cover in such a manner that the ink layer covers the display side of the cover and that the first transparent member in each of the first display holes is exposed from the ink layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.