Semiconductor device
US10112824B2 · kind B2 · utility
0Cited by
3References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2016 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Apr 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a substrate that is made of a semiconductor material and has a main surface formed with a recess. The semiconductor device also includes a wiring layer formed on the substrate, an electronic element housed in the recess, and a sealing resin covering at least a part of the electronic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.