Manufacturing method of casing of electronic device
US10113243B2 · kind B2 · utility
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4Claims
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Key dates
| Filing date | Dec 31, 2015 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Oct 11, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a casing of an electronic device including the following steps is provided. First, a casing body is formed by an injection molding technology, and the casing body includes a button portion. Thereafter, a sensing assembly is electroplated on an inner surface of the casing body. The sensing assembly includes a first conductive line and two first contacts. The first conductive line forms a strain sensing pattern on the button portion, and the two first contacts connect to two ends of the first conductive line, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.