Non-contact temperature measurement sensor
US10113915B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2015 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Dec 5, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J2005/066
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.