Method and aparatus for monitoring a junction between electrical devices
US10114062B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2016 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Apr 13, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0617
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and a test fixture for evaluating a junction between an electrical lead trace and a busbar are described, and include an electric power supply disposed to supply electric power to the electrical lead trace and an electric monitoring device disposed to monitor electrical potential across the junction. A mechanical stress-inducing device is disposed to apply mechanical stress proximal to the junction. The electric monitoring device monitors the electrical potential across the junction of the electrical lead trace coincident with the mechanical stress-inducing device applying mechanical stress proximal to the junction when the electric power supply is supplying electric power to the electrical lead trace. Electrical integrity of the junction is evaluated based upon the monitored electrical potential across the junction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.