Input/output module baffle and motherboard with the same
US10114427B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2017 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Apr 6, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/185
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An input/output module baffle is adapted to an electronic device. The electronic device includes a motherboard and a casing. The motherboard is located inside the casing and includes a connector module. The input/output module baffle includes a fixing plate, a conductive component and a frame. The fixing plate includes a plurality of retaining clips to clamp the fixing plate on the connector module. The conductive component is located between the fixing plate and the connector module. The frame is located between the fixing plate and the casing. Moreover, a motherboard with the input/output module baffle is also disclosed herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.