Chip resistor
US10115505B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2017 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Feb 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/281
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to a chip resistor. A method of manufacturing a chip resistor comprises the steps of: (a) applying a conductive paste on an insulating substrate, wherein the conductive paste comprises, (i) 40 to 80 weight percent (wt. %) of a conductive powder; (ii) 1 to 14 wt. % of a glass frit, (iii) 0.01 to 3 wt. % of magnesium oxide (MgO), and (iv) 10 to 55 wt. % of an organic vehicle, wherein the wt. % is based on weight of the conductive paste; (b) firing the applied conductive paste to form the front electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.