Incorporation of passives and fine pitch through via for package on package
US10115671B2 · kind B2 · utility
10Cited by
10References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2013 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Dec 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This disclosure provides systems, methods and apparatus for glass via bars that can be used in compact three-dimensional packages, including package-on-packages (PoPs). The glass via bars can provide high density electrical interconnections in the PoPs. In some implementations, the glass via bars can include integrated passive components. Packaging methods employing glass via bars are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.