Solid-state imaging device
US10115695B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2017 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Dec 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D88/01
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solid-state imaging device encompasses a detector substrate having a first main-surface, on which a plurality of first lands are arranged in a matrix, and a signal-circuit substrate having a second main-surface, on which plurality of second lands are arranged so as to face the arrangement of the first lands. A plurality of tubular bumps, each of which having a flattened plane pattern, and is provided between each of the first lands and each of the second lands. The tubular bumps respectively have major-axis directions to define inclined angles, and are arranged in the matrix such that the inclined angles differ depending on locations of the plurality of tubular bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.