Electronic device and method for manufacturing the same
US10115696B2 · kind B2 · utility
0Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2016 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Aug 18, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/29193
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device is disclosed, which comprises: a first substrate; an adhesion layer disposed on the first substrate and comprising a condensation product of silane or derivatives thereof; an inorganic layer disposed on the adhesion layer; and an active unit disposed on the inorganic layer. In addition, the present disclosure also provides a method for manufacturing the aforementioned electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.