System and method for curing conductive paste using induction heating
US10115856B2 · kind B2 · utility
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173References
20Claims
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Key dates
| Filing date | Oct 31, 2016 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Jan 3, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
Abstract
One embodiment can provide a system for curing conductive paste applied on photovoltaic structures using induction heating. The system can include a wafer carrier for carrying a plurality of photovoltaic structures and an induction heater. The wafer carrier can include a surface element that is in direct contact with the photovoltaic structures and is substantially thermally insulating. The induction heater can be positioned above the wafer carrier. The induction heater can include a heating coil and core that do not directly contact the photovoltaic structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.