Graded midplane
US10116074B1 · kind B1 · utility
0Cited by
60References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2017 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Apr 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1444
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module includes, a circuit board having front and rear edges, and first and second connectors. The rear edge includes, (i) a first section at a first distance from the front edge, and (ii) a second section at a second distance from the front edge, different from the first distance. The first and second connectors are mounted along the rear edge at the first and second sections, respectively, and are configured to connect the circuit board to an interconnect unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.