Protocol circuit layer
US10116561B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2016 |
| Grant date | Oct 30, 2018 |
| Priority date | — |
| Expiry date | Aug 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L45/74
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A protocol circuit layer is described. The protocol circuit layer may employ a routing layer to determine optimal routes when establishing a circuit. The circuit layer may employ a link layer to send data packets over links to other network nodes. A naming layer may employ circuits to establish a distributed database of associations between network node addresses and their network locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.