Slurry application device and slurry application method
US10118194B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2015 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Sep 2, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D2252/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A slurry application device includes: a slurry supply unit configured to supply slurry to a surface of a traveling base material; a slurry application unit including a first roll body disposed at the downstream side in relation to the slurry supply unit and configured to press the first roll body against the slurry to apply the slurry onto the surface and to adjust an adhesion amount of the slurry such that a film thickness of the slurry becomes one time or more and two times or less of a target film thickness; and a slurry adhesion amount adjustment unit including a second roll body disposed at the downstream side in relation to the slurry application unit and configured to press the second roll body against the slurry to adjust the slurry adhesion amount such that the film thickness of the slurry becomes the target film thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.