Microfluidic die on a support with at least one other die
US10118391B2 · kind B2 · utility
4Cited by
1References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 31, 2016 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Aug 31, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14491
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure provides supports for a microfluidic die and one or more additional die including, but not limited to, microfluidic die, ASICs, MEMS devices, and sensors. This includes semi-flexible supports that allow a microfluidic die to be at a 90 degree angle with respect to another die and rigid supports that allow a microfluidic and another die to be in close proximity to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.