Patent · US Active

Adhesive sealing composition

US10119050B2 · kind B2 · utility

0Cited by
2References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 9, 2015
Grant dateNov 6, 2018
Priority date
Expiry dateOct 27, 2035

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J123/10
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

An adhesive composition that can be used in an extrusion-coating process for application to a support or in an extrusion-laminating process in order to bond several supports of different or identical nature to one another, over a wide temperature range, including: from 91% to 98% by weight of the composition, of a copolymer of ethylene and of alkyl acrylate; at least one tackifying resin; processing aids, wherein the tackifying resin represents between 1.5% and 5.5% of the weight of the composition and the processing aids represent between 0.5% and 3.5% of the weight of the composition and the anti-blocking agent represents, in the processing aids, at least 60% by weight of the aids. Also, a film of the composition and a multilayer structure that includes this film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.