Heat dissipation device
US10119766B2 · kind B2 · utility
6Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2015 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Feb 16, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F1/32
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation device includes a housing and a heat pipe. The heat pipe has an open end, which is inserted into an opening on a top side of the housing, such that a heat pipe chamber of the heat pipe is communicated with a housing chamber of the housing and an extended portion extended from the open end of the heat pipe is pressed against a bottom side of the housing, as well as a heat pipe wick structure of the heat pipe is connected to a housing wick structure of the housing, so as to increase heat transfer effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.