Thin LED flash for camera
US10120266B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2014 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Dec 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8511
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A thin flash module for a camera uses a flexible circuit as a support surface. A blue GaN-based flip chip LED die is mounted on the flex circuit. The LED die has a thick transparent substrate forming a “top” exit window so at least 40% of the light emitted from the die is side light. A phosphor layer conformally coats the die and a top surface of the flex circuit. A stamped reflector having a knife edge rectangular opening surrounds the die. Curved surfaces extending from the opening reflect the light from the side surfaces to form a generally rectangular beam. A generally rectangular lens is affixed to the top of the reflector. The lens has a generally rectangular convex surface extending toward the die, wherein a beam of light emitted from the lens has a generally rectangular shape corresponding to an aspect ratio of the camera's field of view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.