Unibody thermal enclosure
US10120423B1 · kind B1 · utility
3Cited by
40References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2015 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Sep 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0202
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Described herein are unibody thermal enclosures for electronic devices. In some instances, the enclosure is a unibody structure formed by injecting a structural material into the tool suspending thermal absorbing/spreading material and thermal insulating material within a cavity of the tool. In other instances, the thermal absorbing/spreading material may be exposed to circuitry of the electronic device and the thermal insulating material may be exposed to the exterior of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.