Gluing device, gluing method and colloid for packaging devices
US10121580B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 31, 2014 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Jan 15, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F1/0578
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a gluing device, a gluing method and a colloid for packaging devices. The gluing device includes an instillation head configured to guide a glue added with magnetic material in an instillation direction; and a magnetic field generation mechanism configured to apply a magnetic field within the instillation head, so as to apply a force to the magnetic material through the magnetic field in a direction identical to or opposite to the instillation direction. Thus a flow rate of the glue in the instillation direction is controlled through the force applied by the magnetic material to the glue. The glue in the gluing device may be smoothly dripped out at a constant flow rate, thereby to prevent the occurrence of discontinuous or thin glue lines in the related art due to an insufficient pressure during gluing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.