Apparatus, system, and method for improving the thermal conduction of heat sinks
US10121727B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2017 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Aug 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosed apparatus may include (1) a cage designed to hold an optical module, (2) a ramp that is secured to the cage and supports a heat sink such that the heat sink is capable of moving along the ramp, and (3) at least one spring having one end coupled to the ramp and another end coupled to the heat sink, wherein (A) prior to insertion of the optical module into the cage, the spring exerts a force at least partially directed along an axis of insertion of the optical module and (B) insertion of the optical module into the cage moves the heat sink along the ramp such that the force exerted by the spring (I) rotates away from the axis of insertion and (II) presses the heat sink against a surface of the optical module. Various other apparatuses, systems, and methods are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.