Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC)
US10121743B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2017 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Mar 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06544
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Power distribution networks in a three-dimensional (3D) integrated circuit (IC) (3DIC) are disclosed. In one aspect, a voltage drop within a power distribution network in a 3DIC is reduced to reduce unnecessary power dissipation. In a first aspect, interconnect layers devoted to distribution of power within a given tier of the 3DIC are provided with an increased thickness such that a resistance of such interconnect layers is reduced relative to previously used interconnect layers and also reduced relative to other interconnect layers. Further voltage drop reductions may also be realized by placement of vias used to interconnect different tiers, and particularly, those vias used to interconnect the thickened interconnect layers devoted to the distribution of power. That is, the number, position, and/or arrangement of the vias may be controlled in the 3DIC to reduce the voltage drop.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.