Target integrated circuit combined with a plurality of photovoltaic cells
US10121771B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2017 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Feb 27, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/52
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microchip structure and a method for manufacturing thereof are provided. The microchip structure comprises a target integrated circuit (TIC) comprising a first surface and a first power contact at a first location on the first surface of the TIC, the TIC further comprising a second power contact at a second location on the first surface of the TIC; a plurality of photovoltaic (PV) diodes deposited on a first surface of a transparent substrate, each of the PV diodes having an anode coupled to an anode contact and a cathode coupled to a cathode contact, the transparent substrate is transparent to an electromagnetic frequency to which the PV diodes are sensitive; the cathode contact of a first PV diode of the PV diodes is bonded to the first power contact and the anode contact of a second PV diode of the PV diodes is bonded to the second power contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.