Method for manufacturing semiconductor light emitting device package
US10121934B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 9, 2015 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Jan 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0361
Abstract
There is provided a method for manufacturing a semiconductor light emitting device package including steps of disposing a plurality of light emitting structures on a support substrate, each light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, shaping a mixture containing a wavelength conversion material and a glass composition on the plurality of light emitting structures, sintering the mixture to form a wavelength conversion part, removing the support substrate, and cutting the plurality of light emitting structures into individual device units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.