Low power and small form factor infrared imaging
US10122944B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2017 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Jul 10, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M2250/52
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.