Microphone package with an integrated digital signal processor
US10123112B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2015 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | May 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2430/20
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and techniques for providing improved beam forming functionality and/or improve noise cancellation functionality in a microphone package are presented. In an implementation, a device includes a first microelectromechanical systems (MEMS) sensor, a second MEMS sensor, and a digital signal processor. The first MEMS sensor is contained in a first back cavity within the device. The second MEMS sensor is contained in a second back cavity within the device. The digital signal processor generates a cardioid microphone pattern based on data associated with the first MEMS sensor contained in the first back cavity and other data associated with the second MEMS sensor contained in the second back cavity, where the digital signal processor forms at least a portion of the first back cavity and the second back cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.