Patent · US Active

Mounting of components on a printed circuit board

US10123429B2 · kind B2 · utility

1Cited by

7References

11Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Philip Georg Brockerhoff · Munich, DE
Tilo Weide · Zorneding, DE

Key dates

Filing date	Jul 20, 2016
Grant date	Nov 6, 2018
Priority date	—
Expiry date	Sep 19, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/1059
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method for mounting components on a printed circuit board comprising the following steps: Arranging a first component on a first surface of the printed circuit board and a second component on a second surface of the printed circuit board, wherein the first component occupies a laterally overlapping position with the second component; and applying a first force to the first component for mounting it on the printed circuit board and/or applying a second force to the second component for mounting it on the printed circuit board. Further, a printed circuit board is suggested.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.