Memory device with daughter board fastening structure
US10123441B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2017 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Mar 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A memory device is provided. The memory device includes a motherboard, a controller, a first memory unit, a second memory unit and a heat sink. The motherboard includes a contact portion. The controller is disposed on the motherboard and corresponds to the contact portion. The first memory unit is coupled to the motherboard. The first memory unit is located on one side of the controller. The first memory unit includes a plurality of first memory chips. The second memory unit is coupled to the motherboard. The second memory unit is located on another side of the controller. The second memory unit includes a plurality of second memory chips. The heat sink is thermally connected to the controller. The heat sink is located between the first memory unit and the second memory unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.