System and method for thermal management of electronic devices
US10123460B2 · kind B2 · utility
1Cited by
15References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2016 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Nov 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal management system and method for electronic devices is provided. The system includes an electronic device, a heat sink, and a thermally conducting and electrically insulating thermal bridge that is interposed between the electronic device and the heat sink. The thermal bridge thermally couples the electronic device to the heat sink and electrically isolates the electronic device from the heat sink. The electronic device, the heat sink, and the thermal bridge are mounted on a same planar surface of a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.