Heat dissipating system
US10123464B2 · kind B2 · utility
2Cited by
72References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2012 |
| Grant date | Nov 6, 2018 |
| Priority date | — |
| Expiry date | Feb 9, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.