Organosilicon compound, curable silicone composition, and semiconductor device
US10125242B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2015 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Nov 27, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
An organosilicon compound represented by the general formula, a hydrosilylation-curable silicone composition containing the compound as an adhesion promoter, and a semiconductor device having a semiconductor element sealed with a cured product of the composition. To provide a novel organosilicon compound, a curable silicone composition that contains the organosilicon compound as an adhesion promoter, has excellent initial adhesion and adhesion durability to a base material such as an organic resin, and forms a cured product having high light transmittance, and a highly reliable semiconductor device produced using this composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.