Adhesive suitable for a pellicle for EUV lithography and a pellicle using the same adhesive
US10126645B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Oct 28, 2016 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Feb 10, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J183/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A pellicle is proposed in which an adhesive layer is formed of an adhesive which undergoes a hardness change at a rate from −50% through +50% of its initial hardness, measured after curing, when it is let to sit in atmosphere of a temperature of 300 degrees C. for 7 days on end; the rate of hardness change being defined by a following equation: Rate of hardness change (%)={(hardness after the sitting)−(initial hardness before the sitting)}÷initial hardness before the sitting)×100.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.