Electronic document such as a chip card with reduced metallization
US10127490B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2016 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Jun 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The fabrication of an electronic document includes the following steps: —obtaining of a flat body in which is made a cavity of globally rectangular shape including a deep portion surrounded by a countersink and which contains an electronic component having connection terminals situated on this countersink while having the shape of meanders 5A, 5B, —obtaining of a module including a support furnished on a so-called external face with a plurality of external contact zones and on a so-called internal face with a printed circuit including connection pads 4A, 4B of hefty form while being connected to certain at least of the external contact zones, the support being furthermore furnished, on this internal face, with a microcircuit connected to this printed circuit, this module being encased in the cavity by an anisotropic conducting adhesive whose overlap coefficient lies between 5 and 8%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.