Embedded substrate core spiral inductor
US10128037B2 · kind B2 · utility
1Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2015 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Mar 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/2809
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Inductors are fabricated in core layers according to a predefined semiconductor package manufacturing process rules. The inductors provide an embedded substrate trace inductor solution. The inductors may be part of an on-chip voltage regulator or any other circuit design. The inductors provide a core spiral structure to help increase inductance, particularly using magnetic field coupling between inductors. The core layers provide thicker and heavier conductive segments for the inductors, particularly as compared to inductors fabricated in build-up layers according to the semiconductor package manufacturing process rules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.