Wound/stacked ceramic film capacitors, method for making ceramic film capacitors
US10128046B2 · kind B2 · utility
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1References
15Claims
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Assignee
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Key dates
| Filing date | Jun 5, 2015 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Aug 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/32
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention provides a process for making ceramic film capacitors, the process comprising supplying a flexible substrate, depositing a first electrode on a first region of the flexible substrate, wherein the first electrode defines a first thickness, overlaying the first electrode with a dielectric film; and depositing a second electrode on the ceramic film, wherein the second electrode defines a second thickness. Also provided is a capacitor comprising flexible substrate, a first electrode deposited on said flexible substrate, a dielectric overlaying the first electrode; and a second electrode deposited on said dielectric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.