Package structure and fabricating method thereof
US10128181B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2016 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | May 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a first carrier plate, a second carrier plate, a pin group and an encapsulant member. A power component is disposed on a first top surface of the first carrier plate. The second carrier plate is disposed on the first top surface of the first carrier plate. A driving circuit is disposed on a second top surface of the second carrier plate for driving the power component. An opening runs through the second carrier plate, and the power component is accommodated within the opening. The pin group is assembled on the first carrier plate and/or the second carrier plate. The encapsulant member encapsulates the first carrier plate, the second carrier plate, a part of the first pin group and a part of the second pin group, so that the first pin group and the second pin group are partially exposed outside the encapsulant member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.