Fan-out package structure, antenna system and associated method
US10128203B2 · kind B2 · utility
4Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2016 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Feb 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/97
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fan-out package structure is disclosed. The fan-out package structure includes an antenna main body; a redistribution layer (RDL); and an antenna auxiliary body in the RDL. An antenna system is also disclosed. The antenna system includes: an antenna main body, arranged to provide a first resonance; and an antenna auxiliary body, arranged to provide a second resonance through parasitic coupling to the antenna main body; wherein a dimension of the antenna main body is greater than a dimension of the antenna auxiliary body. An associated semiconductor packaging method is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.