Circuit boards and semiconductor packages including protruding pattern on substrate
US10128224B2 · kind B2 · utility
5Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2017 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Jul 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board comprises a mother substrate including first and second scribing regions, the first scribing region extending in first direction, the second scribing region extending in second direction, the first and second directions crossing each other, the mother substrate including chip regions defined by the first and second scribing regions, and a through via penetrating the chip regions of the mother substrate. The mother substrate comprises a first alignment pattern protruding from a top surface of the mother substrate. The first alignment pattern is disposed on at least one of the scribing regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.