Optoelectronic component and method for the production thereof

US10128405B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Stephan Kaiser · Regensburg, DE
• Andreas Ploessl · Regensburg, DE

Key dates

• Filing date: Jun 3, 2009
• Grant date: Nov 13, 2018
• Expiry date: Nov 13, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/835

Abstract

A method of producing an optoelectronic component, comprising the method steps: A) providing a growth substrate (1); B) growing at least one semiconductor layer (2) epitaxially, to produce an operationally active zone; C) applying a metallic mirror layer (3) to the semiconductor layer (2); D) applying at least one contact layer (8) for electronic contacting of the component; E) detaching the growth substrate (1) from the semiconductor layer (2), so exposing a surface of the semiconductor layer (2); and F) structuring the semiconductor layer (2) by means of an etching method from the side of the surface which was exposed in method step E).