Chip-to-chip interface comprising a microstrip circuit to waveguide transition having an emitting patch
US10128557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2016 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Nov 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/087
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a microstrip circuit and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a microstrip circuit. The microstrip circuit includes a feeding line providing a signal, a probe being connected to one end of the feeding line, and a patch emitting the signal to a waveguide. The patch is disposed in a layer opposite to a layer in which the feeding line and the probe are disposed, with a core substrate being positioned therebetween. At least one of length of the probe, thickness of the core substrate, and permittivity of the core substrate is determined based on bandwidth of a transition between the microstrip circuit and the waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.