Patent · US Active

Frame elements for package structures comprising printed circuit boards (PCBs)

US10129972B2 · kind B2 · utility

0Cited by

16References

29Claims

0Family size

Assignee

Avago Technologies International Sales Pte. Limited · SG

Inventors

Martin Fritz · Kobenz, AT
Bernhard Gebauer · Bad Aibling, DE
Lueder Elbrecht · Munich, DE
Martin Handtmann · Riemerling, DE
Oliver Wiedenmann · Munich, DE
Sergej Scherer · Munich, DE

Key dates

Filing date	Oct 30, 2015
Grant date	Nov 13, 2018
Priority date	—
Expiry date	Jan 23, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1316
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An apparatus, includes a substrate, an electronic component disposed over the substrate, and a frame element disposed over the substrate. The frame element provides structural rigidity to the apparatus. The apparatus also includes an encapsulating material disposed over an upper surface of the substrate, the electronic component and the frame element. An electrically conductive layer is disposed over the encapsulating material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.