High performance, ultra low loss, ultra lightweight, multi-layered rigid circuit boards
US10129976B2 · kind B2 · utility
0Cited by
10References
15Claims
0Family size
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Key dates
| Filing date | Apr 21, 2015 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Sep 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electronic component, such as a circuit board, fabricated by coextruding an Ultra High Molecular Weight Polyethylene (UHMWPE) filament, such as a Dyneema® filament, and a conductive material, such as an Indalloy wire, using only a three-dimensional printer, such as an FDM machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.