Patent · US Active

Circuit carrier and a method for producing a circuit carrier

US10129987B2 · kind B2 · utility

0Cited by

1References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Harun Bueyuekgoez · Pfullingen, DE
Roland Gerstner · Reutlingen, DE
Josef Weber · Oberriexingen, DE

Key dates

Filing date	Dec 21, 2015
Grant date	Nov 13, 2018
Priority date	—
Expiry date	Jan 22, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10416
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The invention relates to a circuit carrier (1) comprising a plurality of inorganic substrate layers (1.1) that have partial metallizations (1.2, 1.3, 1.4, 1.5, 1.6) for the purpose of electrical and/or thermal conduction, and to a corresponding method for producing such a circuit carrier (1). According to the invention, at least one partial metallization is made in the form of an insert (1.2) that fills a corresponding shaped hole (1.7) introduced into one of said inorganic substrate layers (1.1).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.