High-pressure card locks for maximizing heat transfer from electronics cards to card cages
US10129996B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2016 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | May 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Card locks for securing electronics card in card slots within cages and designed and configured to allow each card lock to impart high uniform pressure between an electronics card and the corresponding card slot to maximize heat transfer from the electronics card to the card cage to efficiently sink heat generated onboard the electronics card. In some embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively pushes one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state. In other embodiments, a high-pressure card lock of the present disclosure has a pair of low-angle wedges and a locking mechanism that effectively draws one of the wedges along the other wedge to put the high-pressure card lock into its locked, high-pressure-exerting state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.