Immersion cooling systems and methods
US10130008B2 · kind B2 · utility
17Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2016 |
| Grant date | Nov 13, 2018 |
| Priority date | — |
| Expiry date | Apr 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20945
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An immersion cooled electronic arrangement includes a sealed housing, a coolant contained within the housing, and an electronic device submerged within the coolant. An agitator is disposed within the housing to control passive heat transfer between the electronic device and the coolant. An immersion cooling system and related method are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.