Ultrasound sensor and method of manufacturing thereof
US10130339B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 30, 2015 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Apr 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/87
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An ultrasound sensor, including a plurality of ultrasound elements which include a first electrode, a piezoelectric layer, and a second electrode and which are arranged in a first direction and a second direction, in which at least a portion of the plurality of ultrasound elements are grouped, at least one of the first electrode and the second electrode is shared for each of the grouped ultrasound elements, bypass wiring is connected to at least one of the shared first electrode and second electrode, a following α value of the bypass wiring is greater than the α value of the first electrode or second electrode on which the bypass wiring is connected, and the electric resistance value per unit length of the bypass wiring is lower than that of the first electrode or the second electrode. α value=(Young's modulus of Constituent Material)×(cross-sectional area of wiring or electrode).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.