Chemical-mechanical wafer polishing device
US10131031B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2016 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Aug 9, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a chemical-mechanical wafer polishing device having an elastic membrane including a circular action plate portion, a membrane circumferential wall portion extending from a circumferential edge of the action plate portion along a direction perpendicular to a plate surface, and a chamber formed between the action plate portion and the membrane circumferential wall portion. The membrane includes a cooling channel portion having an action plate bottom surface section, and a supply penetration section penetrating the action plate portion such that one end is connected to the action plate bottom surface section and the other end is exposed to the upper side of the action plate portion. The chemical-mechanical wafer polishing device includes a cooling fluid supply portion having a cooling fluid supply tube connected to a free end of the supply penetration section, and providing a cooling fluid to the cooling channel portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.