Method of molding a thermoplastic resin article and apparatus for molding same
US10131087B2 · kind B2 · utility
1Cited by
5References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 11, 2014 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Apr 1, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2011/005
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Aimed at providing a method for molding a thermoplastic resin product and a molding apparatus therefor that enable productivity, transfer quality or the like to be improved. Provided is a method for molding a thermoplastic resin product that includes a heating step, a transfer step, a cooling step and a mold-releasing step, and wherein, in the heating step, a stamper is irradiated with infrared rays in a state where a cooling member is not irradiated with infrared rays, and at least in the final stage of the transfer step, the stamper and the cooling member are brought into contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.