Hermetically sealed molecular spectroscopy cell with dual wafer bonding
US10131115B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2017 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Sep 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B2001/3894
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method include forming a plurality of layers of an oxide and a metal on a substrate. For example, the layers may include a metal layer sandwiched between silicon oxide layers. A non-conductive structure such as glass is then bonded to one of the oxide layers. An antenna can then be patterned on the non-conductive structure, and a cavity can be created in the substrate. Another metal layer is deposited on the surface of the cavity, and an iris is patterned in the metal layer to expose the one of the oxide layers. Another metal layer is formed on a second substrate and the two substrates are bonded together to thereby seal the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.