Bump stop assembly
US10132111B2 · kind B2 · utility
0Cited by
16References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2016 |
| Grant date | Nov 20, 2018 |
| Priority date | — |
| Expiry date | Mar 24, 2036 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE05Y2600/58
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A bump stop assembly is provided for an access door. The assembly comprises a bump stop configured to couple to the access door or a door frame and a door closure gauge movably coupled to the bump stop. A closure pad couples the bump top to one of the door frame or the access door. The closure pad engages the other side of the access door and door frame when the door is closed. The thickness of a selected closure pad is determined based upon the extent that the door closure gauge protrudes relative to the bump stop.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.